Linking the thermal-conductivity plateau to the Cp/T3 hump in amorphous and complex disordered solids

Автор(и)

  • Yu. V. Horbatenko B. Verkin Institute for Low Temperature Physics and Engineering of the National Academy of Sciences of Ukraine Kharkiv 61103, Ukraine
  • O. A. Korolyuk B. Verkin Institute for Low Temperature Physics and Engineering of the National Academy of Sciences of Ukraine Kharkiv 61103, Ukraine
  • A. I. Krivchikov B. Verkin Institute for Low Temperature Physics and Engineering of the National Academy of Sciences of Ukraine Kharkiv 61103, Ukraine
  • M. S. Barabashko B. Verkin Institute for Low Temperature Physics and Engineering of the National Academy of Sciences of Ukraine Kharkiv 61103, Ukraine

DOI (Low Temperature Physics):


https://doi.org/10.1063/10.0043121

Ключові слова:

multi-channel heat transfer, thermal conductivity, low-temperature heat capacity, two-level systems

Анотація

Досліджено взаємозв’язок між низькотемпературним плато теплопровідності та максимумом (Cp/T3) в зведеній теплоємності на прикладі розупорядкованих твердих тіл, включаючи полімери, скло та складні кристалічні матеріали. Використовуючи єдину структуру, яка розділяє частинкоподібне поширення (внесок Пайєрлса) та хвилеподібні когерентні внески, проанализовано експериментальні дані, щоб виділити характерні температури, пов'язані з кожним внеском. Отримані результати показують, що температура максимуму в Cp/T3, Tmax , систематично корелює з початком плато теплопровідності та переходом між частинкоподібним та когерентнодомінуючим транспортом. Нормування частинкоподібного внеску виявляє універсальну поведінку в хімічно та структурно різноманітних системах. Ці результати надають чіткі докази прямого зв'язку між плато теплопровідності та аномаліями низькотемпературної теплоємності, встановлюючи Tmax як надійний характеристичний параметр для прогнозування теплового транспорту в розупорядкованих твердих тілах.

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Опубліковано

2026-02-25

Як цитувати

(1)
Yu. V. Horbatenko, O. A. Korolyuk, A. I. Krivchikov, and M. S. Barabashko, Linking the thermal-conductivity plateau to the Cp/T3 hump in amorphous and complex disordered solids, Low Temp. Phys. 52, 374–380, (2026) [Fiz. Nyzk. Temp. 52, 418–426, (2026)] DOI: https://doi.org/10.1063/10.0043121.

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Том 52 № 4 (2026)

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