Linking the thermal-conductivity plateau to the Cp/T3 hump in amorphous and complex disordered solids
DOI (Low Temperature Physics):
https://doi.org/10.1063/10.0043121Ключові слова:
multi-channel heat transfer, thermal conductivity, low-temperature heat capacity, two-level systemsАнотація
Досліджено взаємозв’язок між низькотемпературним плато теплопровідності та максимумом (Cp/T3) в зведеній теплоємності на прикладі розупорядкованих твердих тіл, включаючи полімери, скло та складні кристалічні матеріали. Використовуючи єдину структуру, яка розділяє частинкоподібне поширення (внесок Пайєрлса) та хвилеподібні когерентні внески, проанализовано експериментальні дані, щоб виділити характерні температури, пов'язані з кожним внеском. Отримані результати показують, що температура максимуму в Cp/T3, Tmax , систематично корелює з початком плато теплопровідності та переходом між частинкоподібним та когерентнодомінуючим транспортом. Нормування частинкоподібного внеску виявляє універсальну поведінку в хімічно та структурно різноманітних системах. Ці результати надають чіткі докази прямого зв'язку між плато теплопровідності та аномаліями низькотемпературної теплоємності, встановлюючи Tmax як надійний характеристичний параметр для прогнозування теплового транспорту в розупорядкованих твердих тілах.
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